Jeng-Hau Huang

1PUBLICATIONS
2CO-AUTHORS
Circuits and systems
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Publications (1)

|Apr 13, 2024
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications.

Jeng-Hau Huang, Po-Shao Shih, Vengudusamy Renganathan

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Frequent Collaborators

1 joint publications

Vengudusamy Renganathan

1 joint publications

Chengheng Robert Kao