Chengheng Robert Kao
9PUBLICATIONS
5CO-AUTHORS
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Publications (9)
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|Apr 13, 2024
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications.Jeng-Hau Huang, Po-Shao Shih, Vengudusamy Renganathan
|Feb 24, 2024
Phase Equilibria Related to NiGa5 in the Binary Ni-Ga System.Chih-Chia Bill Chang, C R Kao
|Nov 09, 2023
Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study.Simon Johannes Gräfner, Jeng-Hau Huang, Po-Yi Wu
|Sep 28, 2023
Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate.Han-Tang Hung, Fu-Ling Chang, Chin-Hao Tsai
|May 13, 2023
Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling.Fu-Ling Chang, Yu-Hsin Lin, Han-Tang Hung
|Nov 11, 2022
Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration.Po-Yu Kung, Wei-Lun Huang, Chin-Li Kao
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