Eiji Higurashi
6PUBLICATIONS
4CO-AUTHORS
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Publications (6)
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|Apr 26, 2025
Wafer Bonding of GaAs and SiC via Thin Au Film at Room Temperature.Kai Takeuchi, Eiji Higurashi
|Nov 11, 2022
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging.Takashi Matsumae, Shingo Kariya, Yuichi Kurashima
|Oct 27, 2022
An Ultra-Compact MEMS Pirani Sensor for In-Situ Pressure Distribution Monitoring.Lan Zhang, Jian Lu, Hideki Takagi
|Jan 28, 2022
Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging.Shingo Kariya, Takashi Matsumae, Yuichi Kurashima
|Feb 21, 2019
Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au⁻Au Bonding Using Ultrathin Au Films.Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima
|Feb 21, 2019
Residual Stress in Lithium Niobate Film Layer of LNOI/Si Hybrid Wafer Fabricated Using Low-Temperature Bonding Method.Ryo Takigawa, Toru Tomimatsu, Eiji Higurashi
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