Lianhuan Han
9PUBLICATIONS
14CO-AUTHORS

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Publications (9)
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|Apr 08, 2026
Complexation Mechanism of a Novel Alkaline Cu(I) Electroplating System Investigated by UV-Visible Spectroscopy.Lixin Yu, Yuqing Feng, Zhao-Yun Wang
|Aug 04, 2025
Potential- and Convection-Dependent Synergistic Coadsorption of Electroplating Additives for Vias Copper Interconnection Evidenced by Shell-Isolated Nanoparticle-Enhanced Raman Spectroscopy.Si-Yu Chen, Hao-Fei Geng, Jia-Qiang Yang
|Apr 08, 2025
Scanning Contact Force Microscope-Scanning Electrochemical Microscopy: A New Approach for Tip Positioning and Simultaneous Imaging of Interfacial Topography and Activity.Yang Wang, Xuesen Zhao, Donghua Zhao
|Dec 22, 2023
Regulation of heterogeneous electron transfer reactivity by defect engineering through electrochemically induced brominating addition.Lanping Zeng, Lianhuan Han, Wenjing Nan
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Frequent Collaborators
8 joint publications
Dongping Zhan
3 joint publications
Ren Hu
2 joint publications
Fang-Zu Yang
2 joint publications
Christian Amatore
2 joint publications
Zhong-Qun Tian
2 joint publications
Jun Cheng
1 joint publications
Bin Ren
1 joint publications
Matthew M Sartin
1 joint publications
Jian-Feng Li
1 joint publications
Yann Leroux