Fang-Zu Yang

5PUBLICATIONS
8CO-AUTHORS
Circuits and systemsElectrometallurgyElectrical circuits and systemsMolecular and organic electronicsColloid and surface chemistry
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Publications (5)

|Apr 17, 2026
Understanding Molecular Properties of Bismarck Brown R and Its Effects on the Electroreduction of Copper Ions at a Polarized Interface: Toward Void-Free Filling of Microvia.

|Apr 08, 2026
Complexation Mechanism of a Novel Alkaline Cu(I) Electroplating System Investigated by UV-Visible Spectroscopy.

Lixin Yu, Yuqing Feng, Zhao-Yun Wang

|Aug 04, 2025
Potential- and Convection-Dependent Synergistic Coadsorption of Electroplating Additives for Vias Copper Interconnection Evidenced by Shell-Isolated Nanoparticle-Enhanced Raman Spectroscopy.

Si-Yu Chen, Hao-Fei Geng, Jia-Qiang Yang

|Apr 22, 2025
Study on the Action Mechanism of a Nontraditional Thioamide-Based Leveler of 1-Phenyl 2-Thiourea for Microvia Void-Free Filling.

Zhao-Yun Wang, Li-Xin Yu, Yu-Qing Feng

|Sep 16, 2021
Suppressing Sulfite Dimerization at a Polarized Gold Electrode/Water Solution Interface for High-Quality Gold Electrodeposition.

Jia-Qiang Yang, Lei Jin, Yuan-Hui Xiao

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Frequent Collaborators

4 joint publications

DongPing Zhan

2 joint publications

Lei Jin

2 joint publications

Ren Hu

2 joint publications

Lianhuan Han