Lei Jin

2PUBLICATIONS
3CO-AUTHORS
Circuits and systemsMolecular and organic electronics
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Publications (2)

|Apr 17, 2026
Understanding Molecular Properties of Bismarck Brown R and Its Effects on the Electroreduction of Copper Ions at a Polarized Interface: Toward Void-Free Filling of Microvia.

|Apr 22, 2025
Study on the Action Mechanism of a Nontraditional Thioamide-Based Leveler of 1-Phenyl 2-Thiourea for Microvia Void-Free Filling.

Zhao-Yun Wang, Li-Xin Yu, Yu-Qing Feng

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Frequent Collaborators

2 joint publications

Fang-Zu Yang

1 joint publications

DongPing Zhan

1 joint publications

Shi-Gang Sun