Wim Deferme
17PUBLICATIONS
38CO-AUTHORS
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Publications (17)
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|Sep 27, 2025
Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications.Kai Werum, Wolfgang Eberhardt, Dieter Reenaers
|Nov 15, 2024
Interfacial Metal Chlorides as a Tool to Enhance Charge Carrier Dynamics, Electroluminescence, and Overall Efficiency of Organic Optoelectronic Devices.Shabnam Ahadzadeh, Beatriz de la Fuente, Hamid Hamed
|Jun 25, 2024
Diels-Alder Network Blends as Self-Healing Encapsulants for Liquid Metal-Based Stretchable Electronics.Fatemeh Sahraeeazartamar, Seppe Terryn, Rathul Nengminza Sangma
|Dec 28, 2023
The Influence of UV-Ozone, O2 Plasma, and CF4 Plasma Treatment on the Droplet-Based Deposition of Diamond Nanoparticles.Pieter Verding, Rani Mary Joy, Dieter Reenaers
|Mar 17, 2023
Plasmon enhanced fluorescence from meticulously positioned gold nanoparticles, deposited by ultra sonic spray coating on organic light emitting diodes.Rachith Shanivarasanthe Nithyananda Kumar, Maarten Eerdekens, Yovan de Coene
|Dec 24, 2021
Biocompatibility Testing of Liquid Metal as an Interconnection Material for Flexible Implant Technology.Katharina Foremny, Steven Nagels, Michaela Kreienmeyer
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Frequent Collaborators
5 joint publications
Mieke Buntinx
4 joint publications
Roos Peeters
3 joint publications
Rachith Shanivarasanthe Nithyananda Kumar
2 joint publications
Manoj Jose
2 joint publications
Naveen Reddy
1 joint publications
W Marchal
1 joint publications
F Mattelaer
1 joint publications
K Van Hecke
1 joint publications
André Zimmermann
1 joint publications
Ida Nuramdhani
