André Zimmermann
21PUBLICATIONS
26CO-AUTHORS

Get your video featured.

Get your video featured.
Publications (21)
Sort by Publication Date:
|Sep 27, 2025
Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications.Kai Werum, Wolfgang Eberhardt, Dieter Reenaers
|Jun 27, 2025
Process Development Methods in Microtechnology and the Associated Process Environment.Korbinian T Metz, Faruk Civelek, André Zimmermann
|Jun 27, 2024
Dielectric Properties of PEEK/PEI Blends as Substrate Material in High-Frequency Circuit Board Applications.Tim Scherzer, Marius Wolf, Kai Werum
|Jun 28, 2023
Injection Molding of Encapsulated Diffractive Optical Elements.Stefan Wagner, Kevin Treptow, Sascha Weser
|Mar 11, 2023
Adhesion-Induced Demolding Forces of Hard Coated Microstructures Measured with a Novel Injection Molding Tool.Maximilian Schoenherr, Holger Ruehl, Thomas Guenther
Pageof 4
Frequent Collaborators
5 joint publications
Thomas Guenther
3 joint publications
Adrian Schwenck
2 joint publications
Florian Janek
2 joint publications
Rafat Saleh
2 joint publications
Tobias Vieten
2 joint publications
Faruk Civelek
2 joint publications
Wolfgang Eberhardt
2 joint publications
Holger Ruehl
2 joint publications
André Bülau
2 joint publications
Daniela Walter