Wolfgang Eberhardt
2PUBLICATIONS
3CO-AUTHORS
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Publications (2)
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|Sep 27, 2025
Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications.Kai Werum, Wolfgang Eberhardt, Dieter Reenaers
|Jun 27, 2024
Dielectric Properties of PEEK/PEI Blends as Substrate Material in High-Frequency Circuit Board Applications.Tim Scherzer, Marius Wolf, Kai Werum
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