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Honghui Zhang

1PUBLICATIONS

1CO-AUTHORS

Compound semiconductors

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Publications (1)

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|Dec 11, 2023

Preparation and performance of semiconductor device bonding joints based on Cu@Sn@Ag preform.

Honghui Zhang, Hongyan Xu, Tianwen Wang

Pageof 1

Frequent Collaborators

1 joint publications

Hongyan Xu

Frequent Collaborators

1 joint publications

Hongyan Xu

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