Hongyan Xu
2PUBLICATIONS
1CO-AUTHORS
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Publications (2)
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|Dec 11, 2023
Preparation and performance of semiconductor device bonding joints based on Cu@Sn@Ag preform.Honghui Zhang, Hongyan Xu, Tianwen Wang
|Nov 02, 2022
Fabrication of Cu@Sn TLPS joint for high temperature power electronics application.Honghui Zhang, Hongyan Xu, Xuan Liu
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