Anthony Engler

5PUBLICATIONS
15CO-AUTHORS
Circuits and systemsElectrochemical energy storage and conversionElectrochemistryElectrical energy transmission, networks and systemsPowder and particle technology
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Publications (5)

|May 25, 2026
Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects.

|Oct 17, 2025
Anolyte Buffering and CO Coverage Effects in the Electrochemical Reduction of CO at Cu Electrocatalysts.

Mustapha Bello, Monsuru Olatunji Dauda, John Hendershot

|Sep 26, 2025
Highly Selective Electrolytic Reduction of CO<sub>2</sub> to Ethylene.

Monsuru Olatunji Dauda, Mustapha Bello, John Hendershot

|Dec 18, 2024
Fundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects.

Junghyun Park, Monsuru Dauda, Mustapha Bello

|Aug 07, 2024
Photoactivated Cyclic Polyphthalaldehyde Microcapsules for Payload Delivery.

Youngsu Shin, Jared M Schwartz, Anthony C Engler

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Frequent Collaborators

4 joint publications

Junghyun Park

4 joint publications

John Flake

3 joint publications

Monsuru Olatunji Dauda

3 joint publications

Mustapha Bello