I-Hsiang Tseng

5PUBLICATIONS
2CO-AUTHORS
Engineering electromagneticsElectrical circuits and systemsMicro- and nanosystemsComposite and hybrid materialsNanomaterials
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Publications (5)

|May 08, 2023
Sputtered anti-reflection layer on transparent polyimide - substrate improves adhesion strength to - copper layer: effects of layer thickness and sputtering power.

Yuan-Nan Tsai, Shih-Chieh Chin, Hsin-Yo Chen

|Feb 23, 2023
Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer.

Yuan-Nan Tsai, Shih-Chieh Chin, Hsin-Yo Chen

|Jan 11, 2023
Tailoring Copper Chemical Status and Hydrophobicity of Biomimetic Photocatalytic Films for Carbon Dioxide Conversion.

I-Hsiang Tseng, Yu-Hsuian Yang, Yi-Ting Chen

|Jul 22, 2022
Polyimide-derived graphite barrier layer adhered to seed crystals to improve the quality of grown silicon carbide.

Ming-Syuan Li, Mei-Hui Tsai, Yan-Lin Wang

|Apr 10, 2019
Anatase TiO₂-Decorated Graphitic Carbon Nitride for Photocatalytic Conversion of Carbon Dioxide.

I-Hsiang Tseng, Yu-Min Sung, Po-Ya Chang

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Frequent Collaborators

2 joint publications

Mei-Hui Tsai

1 joint publications

Ta-I Yang