Yidong Tian

2PUBLICATIONS
1CO-AUTHORS
Signal processingMicrotechnology
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Publications (2)

|Jul 02, 2026
An integrated framework TSV-INet for arbitrarily distributed TSV interposer wafer warpage simulation.

|Mar 11, 2026
Electrohydrodynamic printing technology: mechanisms, control, and applications.

Yidong Tian, Jiajun Zhou, Hengjia Zhu

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Frequent Collaborators

1 joint publications

Sheng Liu