Wenxin Cao
2PUBLICATIONS
1CO-AUTHORS

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Publications (2)
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|Aug 28, 2025
High Thermal Conductivity Diamond-Copper Composites Prepared via Hot Pressing with Tungsten-Coated Interfacial Layer Optimization.Qiang Wang, Zhijie Ye, Lei Liu
|Jul 20, 2024
Diamond-Reinforced Al(H2PO4)3@Epoxy Hybrid Thermal Adhesive With Ultra-High Thermal Conductivity and Bonding Strength.Ge Gao, Yuwei Zhao, Wenxin Cao
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