一个基于FPGA的IoV高效的SM9聚合签名方案
Bolin Zhang1, Bin Li1, Jiaxin Zhang1
1School of Computer and Artificial Intelligence, Zhengzhou University, Zhengzhou 450001, China.
Sensors (Basel, Switzerland)
|September 28, 2024
概括
本研究在FPGA上引入了一种高效的SM9聚合签名方案,用于汽车互联网 (IoV). 该方案在容错和不容错的场景中大大缩短了签名验证时间.
科学领域:
- 密码学 密码学 密码学 密码学
- 计算机工程 计算机工程
- 网络安全 网络安全
背景情况:
- 由于汽车互联网 (IoV) 的快速发展,需要安全高效的签名验证.
- 现有的方案可能无法充分满足各种网络环境的需求.
- 在车辆网络中,对强大的加密解决方案的需求至关重要.
研究的目的:
- 提出一个高效的SM9聚合签名方案,在现场可编程门阵列 (FPGA) 上实施.
- 为各种网络条件开发容错和不容错的聚合签名模式.
- 在 IoV 环境中提高签名验证速度和效率.
主要方法:
- 在FPGA上实施SM9聚合签名方案.
- 设计耐故障和不耐故障的聚合签名模式.
- 使用FPGA功能开发一个高效的平行点乘法架构,并使用蒙哥马利乘法和巴雷特减法算法进行优化.
- 基于K-ary计算添加式Diffie-Hellman (K-CAA) 问题的安全证明.
主要成果:
- 实现了每秒70,776次的点乘倍速度.
- 与无错误条件下的其他方案相比,非容错模式将验证时间缩短了高达97.1%.
- 与其他方案相比,容错模式将验证时间缩短了高达77.2%.
- 拟议的容错方案的验证时间仅为其他容错方案的28.9%.
- 与其他方案相比,非容错模式验证时间至少减少了39.1%.
结论:
- 拟议的基于FPGA的SM9聚合签名方案为验证效率提供了显著的改进.
- 该方案在IOV的无错和容错场景中都显示出了实质性的优势.
- 优化的并行架构有效地解决了汽车网络安全的计算需求.
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