FPGAIoVSM9

Bolin Zhang1, Bin Li1, Jiaxin Zhang1

  • 1School of Computer and Artificial Intelligence, Zhengzhou University, Zhengzhou 450001, China.

Sensors (Basel, Switzerland)
|September 28, 2024
PubMed
概括

本研究在FPGA上引入了一种高效的SM9聚合签名方案,用于汽车互联网 (IoV). 该方案在容错和不容错的场景中大大缩短了签名验证时间.

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