在高电子流动性 GaN 晶体管中,负电容超过了 Schottky 门极限
Asir Intisar Khan1,2, Jeong-Kyu Kim3, Urmita Sikder1
1Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA.
概括
研究人员开发了一种用于高电子流动性晶体管的新门介电器. 这种铁性HfO2-ZrO2双层增加了ON电流,同时减少了泄漏,克服了传统的Schottky GaN晶体管的局限性.
科学领域:
- 材料科学
- 半导体物理
- 设备工程
背景情况:
- 高电子流动性晶体管 (HEMT) 使用二维电子气体 (2DEG) 实现高性能.
- 在AlGaN/GaN HEMT中,Schottky门最大化诱导电荷和电流,但受到高门泄漏的影响.
- 传统的介电层可以减少泄漏,但也可以减少排水电流,从而降低性能.
研究的目的:
- 克服HEMT中的传统门介电的局限性.
- 实现同时增强开启电流和减少泄漏电流.
- 探索铁电材料作为高级半导体设备的门介电材料.
主要方法:
- 用铁二层HfO2-ZrO2作为门介电的制造.
- 将双层集成到HEMT的AlGaN/GaN异构中.
- 晶体管性能的描述,包括ON电流和泄漏电流.
主要成果:
- 与传统的Schottky门相比,HfO2-ZrO2双层显著增加了ON电流.
- 在新的介电器中观察到门泄漏电流的大幅下降.
- 这种改进的电流和减少泄漏的组合在标准介电剂中是前所未有的.
结论:
- 铁的HfO2-ZrO2双层为高性能HEMT提供了一个新的解决方案.
- 这种方法超越了与Schottky门设计相关的传统权衡.
- 它为基于2DEG技术的晶体管开辟了新的道路.
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