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Related Experiment Videos

A high-resolution serial sectioning specimen preparation technique for application to electron backscatter

M A Wall1, A J Schwartz, L Nguyen

  • 1Lawrence Livermore National Laboratory, Chemistry and Materials Science Directorate, Livermore, CA 94550, USA. wall1@llnl.gov

Ultramicroscopy
|June 23, 2001
PubMed
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A new serial sectioning technique precisely removes material for high-resolution electron backscatter diffraction (EBSD) analysis. This method ensures accurate measurements and registration for detailed crystallographic orientation imaging.

Area of Science:

  • Materials Science
  • Crystallography
  • Analytical Chemistry

Background:

  • Electron Backscatter Diffraction (EBSD) is crucial for analyzing material microstructures.
  • Accurate 3D crystallographic mapping requires precise serial sectioning and registration.
  • Existing methods often lack reproducibility and precise thickness control.

Purpose of the Study:

  • To develop a reproducible serial sectioning technique for high-resolution EBSD data acquisition.
  • To enable accurate measurement of removed material thickness and registration of EBSD scans.
  • To produce quality surfaces on polycrystalline tantalum (Ta) for orientation imaging.

Main Methods:

  • A high-resolution serial sectioning specimen preparation technique was developed.

Related Experiment Videos

  • A metrology device with high-precision etching patterns was fabricated using lithography.
  • The technique integrates controlled material removal, thickness measurement, and scan registration.

    • Main Results:

    • The method allows reproducible removal of controlled material thickness from polycrystalline Ta.
    • Quality surfaces suitable for EBSD orientation imaging were produced.
    • Sub-micron measurement of slice thickness and ~1 micrometer registration accuracy were achieved.

    Conclusions:

    • The described serial sectioning technique enhances accuracy and reproducibility in EBSD analysis.
    • This method facilitates detailed 3D crystallographic characterization of materials.
    • The integrated metrology device is key to achieving high precision in serial sectioning EBSD.