Effects of high-speed curing devices on shear bond strength and microleakage of orthodontic brackets

This study evaluated the shear-peel bond strength and mode of bond failure of 3 curing devices (plasma arc light, argon laser, and conventional halogen light) and 2 orthodontic bracket adhesives with different filler contents (Transbond XT and Adhesive Precoated [APC]). Observations of microleakage were also reported. Ninety human adolescent premolars were randomly divided into 6 groups, and standardized brackets were bonded according to the manufacturers' recommendations. The plasma arc light produced significantly (P =.006) higher bond strength than did the halogen light or the argon laser when Transbond was used. When APC was used, the plasma arc light and the halogen light produced similar results, and they both produced significantly (P =.015) higher bond strengths than did the argon laser. Overall, the APC showed substantially less variation in bond strength than did the Transbond. Although all curing methods showed significant microleakage (P <.001), differences among the 3 curing lights occurred only when APC was used. Microscopic evaluations demonstrated that 95% of the specimens failed for adhesion at the bracket or tooth surface; the argon laser produced the highest adhesive remnant index scores. On the basis of bond strength and microleakage results, the plasma arc light was comparable with or superior to the other curing devices, depending on the adhesive used.