Incompatibility of self-etch adhesives with chemical/dual-cured composites: two-step vs one-step systems

This study tested the null hypothesis that there no difference between two-step and one-step self-etch adhesives in their compatibility with these composites. The microtensile bond strengths (microTBS) of two two-step systems (Clearfil SE Bond, Kuraray and Tyrian SPE/One-Step Plus, BISCO) were compared with two one-step systems (Xeno III, Dentsply DeTrey and Brush&Bond, Parkell) for their coupling to a dual-cured composite. Silver tracer penetration of the four adhesives bonded to a light-cured or a chemical-cured composite was examined using TEM. Significant differences in microTBSs between composite curing modes were seen only in the one-step adhesives. For one-step self-etch adhesives bonded to the chemical-cured composite, TEM revealed signs of frank composite uncoupling along the adhesive-composite interface, which may be attributed to the adverse chemical interaction between the acidic adhesive and the composite. In addition, "water trees" that represent channels of increased permeability with the polymerized adhesive layer were also observed in the one-step adhesives. Both features were absent along the resin-dentin interfaces when chemical-cured composites were coupled to the two-step self-etch adhesives.