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Crystallographic analysis of thin specimens
V G M Sivel1, F D Tichelaar, H Mohdadi
1Netherlands Institute for Metals Research, Rotterdamseweg 137, 2628 AL Delft, The Netherlands. V.G.M.sivel@tnw.tudelft.nl
Journal of Microscopy
|April 29, 2005
Summary
Electron backscattering diffraction (EBSD) on thin specimens, prepared using a focused ion beam, offers improved crystallographic analysis. This method enhances pattern quality and spatial resolution for materials like copper-gold alloys.
Area of Science:
- Materials Science
- Crystallography
- Electron Microscopy
Background:
- Electron backscattering diffraction (EBSD) is a standard technique for bulk sample crystallographic characterization.
- Focused ion beam (FIB) milling is used for preparing transmission electron microscopy (TEM) specimens.
- Copper-gold (Cu3Au) alloy is a relevant material for studying crystallographic properties.
Purpose of the Study:
- To investigate the application of EBSD on TEM-type thin specimens.
- To evaluate the quality and resolution of EBSD analysis on FIB-prepared samples.
- To compare EBSD performance on thin specimens versus bulk samples.
Main Methods:
- Preparation of thin specimens using focused ion beam (FIB) milling.
- Acquisition of orientation maps using electron backscattering diffraction (EBSD).
- Analysis of EBSD pattern quality and spatial resolution on Cu3Au alloy specimens.
Main Results:
- Successful collection of orientation maps on FIB-prepared thin Cu3Au specimens.
- Achieved improved EBSD pattern quality compared to bulk samples.
- Obtained high spatial resolution, well below 10 nm.
- Observed enhanced signal-to-noise ratio with decreasing sample thickness.
Conclusions:
- EBSD is effectively applicable to TEM-type thin specimens prepared by FIB.
- Thin specimen EBSD provides superior crystallographic information and resolution.
- Sample thickness is a critical factor for optimizing EBSD signal-to-noise ratio.