Phase Transitions: Melting and Freezing
Fermi Level
Fermi Level Dynamics
Types of Semiconductors
Metal-Semiconductor Junctions
Biasing of Metal-Semiconductor Junctions
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Updated: May 1, 2026

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Kerwyn Casey Huang1, Tairan Wang, John D Joannopoulos
1Center for Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA. kchuang@princeton.edu
Coating semiconductor surfaces with a single monolayer of a different material can alter melting points. This study shows GaAs on Ge prevents melting, while Ge on GaAs induces melting.
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