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Updated: Jul 5, 2026

Sub-nanometer Resolution Imaging with Amplitude-modulation Atomic Force Microscopy in Liquid
Published on: December 20, 2016
Electrical discharge in a nanometer-sized air/water gap observed by atomic force microscopy
Xian Ning Xie1, Hong Jing Chung, Chorng Haur Sow
1NUS Nanoscience and Nanotechnology Initiative (NUSNNI), and Department of Physics, National University of Singapore, 2 Science Drive 3, Singapore 117542. nnixxn@nus.edu.sg
Researchers developed a novel method using atomic force microscopy (AFM) to study electrical discharges in nanoscale gaps. This research reveals insights into nanoexplosions and shock wave generation for potential microstructuring applications.
Area of Science:
- Physics
- Materials Science
- Chemistry
Background:
- Electrical discharges in confined spaces are poorly understood.
- Nanoscale phenomena present unique challenges for investigation.
Purpose of the Study:
- To develop and demonstrate a method for initiating and studying electrical discharges in nanometer-sized gaps.
- To investigate the factors influencing discharge probability and the resulting physical phenomena.
Main Methods:
- Utilized a standard atomic force microscopy (AFM) setup to create a discharge gap of <= 5 nm between an AFM probe and a substrate.
- Combined experimental AFM observations with computational simulations including boundary element method (BEM), finite element method (FEM), and method of characteristics (MOC).
Main Results:
- Observed highly localized stochastic nanoexplosions.
- Discharge probability was found to be dependent on electric field, material-specific surface reactions, and humidity.
- Identified the generation and propagation of transient shock waves within the nanoscale discharge.
- Demonstrated that shock wave propagation aids in the radial expansion of ionized particles, forming microscale patterns.
Conclusions:
- Provided initial understanding of nanoscale electrical discharges and associated phenomena.
- Findings suggest potential applications in nano/microstructuring, microelectronics, and plasma-assisted deposition techniques.
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