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Published on: February 12, 2017
Additive soft-lithographic patterning of submicrometer- and nanometer-scale large-area resists on electronic
Heejoon Ahn1, Keon Jae Lee, Anne Shim
1Department of Chemistry, Beckman Institute and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Abstract:
We describe a novel soft-lithographic technique possessing broad utility for the fabrication of large area, nanoscale ( approximately 100 nm) multilayer resist structures on electronic material substrates. This additive patterning method transfers ultrathin poly(dimethylsiloxane) (PDMS) decals to an underlying SiO(2)-capped organic planarazation layer. The PDMS patterns serve as a latent image through which high-quality multilayer resist structures can be developed using reactive ion-beam etching.
