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Updated: Aug 7, 2026

Characterization of Thermal Transport in One-dimensional Solid Materials
Published on: January 26, 2014
New device and method for measuring thermal conductivity of thin-films
Chelakara S Subramanian1, Tahani Amer, Billy T UpChurch
1Mechanical & Aerospace Engineering, Florida Institute of Technology, Melbourne 32901, USA.
Abstract:
Thermal sensitive paints (TSPs) are used for global nonintrusive detection of boundary layer transition in flow over the surface of wind tunnel research models. Since the transition is a transient process, the TSP should have a fast response characteristic. A low paint thermal conductivity is required for fast response. A thin-film thermal conductivity meter (TFTCM) was designed and built to measure thermal conductivity of the TSPs, which are typically between 50 and 150 microm thick. In this paper, the design and operating features of the TFTCM are described. Measurement of the thermal conductivity with this TFTCM of three standard thin-film low conductivity specimens, Kapton, Teflon, and Borofloat glass, showed good agreement with the manufacturer quoted values, thus validating the instrument and the procedure. Consistently repeatable values for thermal conductivity (k=0.41 +/- 0.02 W/m K) were also obtained for the TSP specimen (TSB-B, 75 microm) tested.

