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Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
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Coherent spin transport through a 350 micron thick silicon wafer

Biqin Huang1, Douwe J Monsma, Ian Appelbaum

  • 1Electrical and Computer Engineering Department, University of Delaware, Newark, Delaware, 19716, USA. bqhuang@udel.edu

Physical Review Letters
|November 13, 2007
PubMed

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