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Optical imaging applied to microelectronic chip-to-chip interconnections.

R K Kostuk1, J W Goodman, L Hesselink

  • 1Stanford University, Electrical Engineering Department, Stanford, California 94305, USA.

Applied Optics
|September 1, 1985
PubMed
Summary

This study introduces a novel holographic imaging system as an alternative to traditional metallized connections for integrated circuits, demonstrating its potential for efficient optical interconnects.

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Area of Science:

  • Optoelectronics
  • Holography
  • Integrated Circuit Interconnects

Background:

  • Metallized connections in integrated circuits face limitations in speed and power consumption.
  • Electrooptic links offer a potential alternative but require efficient optical components.
  • Holographic optical elements present a promising solution for advanced optical systems.

Purpose of the Study:

  • To propose and evaluate a holographic imaging system as a viable alternative to metallized interconnects.
  • To compare the power requirements of metallized interconnects and proposed electrooptic links.
  • To investigate the performance of holographic optical elements in experimental optical interconnect systems.

Main Methods:

  • A holographic optical element was designed and implemented as the core imaging device.
  • Experimental systems were constructed using visible Light Emitting Diodes (LEDs) as transmitters and PIN photodiodes as receivers.
  • Signal performance was assessed at various source-detector distances.
  • Multiple exposure holograms were utilized for optical fan-out capabilities.

Main Results:

  • The holographic imaging system demonstrated successful signal transmission between LEDs and photodiodes.
  • Optical fan-out was achieved, enabling a single source to address multiple receivers simultaneously.
  • The power requirements of the electrooptic links were analyzed in comparison to metallized interconnects.
  • The effectiveness of holographic elements in optical interconnects was experimentally validated.

Conclusions:

  • Holographic imaging systems offer a promising, power-efficient alternative to conventional metallized interconnects for integrated circuits.
  • The demonstrated optical fan-out capability is crucial for scalable and complex interconnect architectures.
  • Further research into the limitations and optimization of this technique is warranted for practical implementation.