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Interchip link system using an optical wiring method.

In-Kui Cho1, Jin-Hwa Ryu, Myung-Yung Jeong

  • 1Electronics and Telecommunications Research Institute, Daejeon, Korea. cho303@etri.re.kr

Optics Letters
|August 19, 2008
PubMed
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This study introduces a compact chip-scale optical link system using plastic optical fibers (POFs) for high-density interchip communication. The developed system enables efficient data transfer and on-site installation, advancing optical interconnect technologies.

Area of Science:

  • Optoelectronics
  • Materials Science
  • Computer Engineering

Background:

  • High-density optical interchip interconnection is crucial for advanced electronic devices.
  • Existing optical link systems face challenges in miniaturization and on-site installation.

Purpose of the Study:

  • To develop a chip-scale optical link system for high-density interchip communication.
  • To introduce novel optical wiring technologies for simplified installation and miniaturization.

Main Methods:

  • A chip-scale optical link system was designed, integrating a transmitter/receiver, metal optical bench, PCB module, driver/receiver IC, and VCSEL/photodiode array.
  • Downsized plastic optical fibers (POFs) and a novel annealing-based optical wiring method were developed.
  • Data transfer measurements were conducted to evaluate system performance.

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Main Results:

  • A functional chip-scale optical link system was successfully demonstrated.
  • The developed downsized POF and optical wiring method facilitate high-density interconnection.
  • Successful data transfer was confirmed through measurements.

Conclusions:

  • The presented chip-scale optical link system offers a viable solution for high-density optical interchip communication.
  • The novel optical wiring technology simplifies installation and enables miniaturization.
  • This advancement holds potential for next-generation electronic devices requiring efficient optical interconnects.