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Updated: Jun 26, 2026

A Novel Method for In Situ Electromechanical Characterization of Nanoscale Specimens
Published on: June 2, 2017
Fast and simple specimen preparation for TEM studies of oxide films deposited on silicon wafers
Valentin S Teodorescu1, Marie-Genevieve Blanchin
1National Institute of Material Physics, 105 bis Atomistilor Street, R-077125, Bucharest-Măgurele, Romania. teoval@infim.ro
Abstract:
We present a fast and simple method to prepare specimens for transmission electron microscopy studies of oxide thin films deposited on silicon substrates. The method consists of scratching the film surface using a pointed diamond tip, in a special manner. Small and thin fragments are then detached from the film and its substrate. Depending on the scratching direction, the fragments can be used for plan-view or cross-section imaging. High-resolution images can be also obtained from thin edges of the film fragments. The method is demonstrated in the case of HfO2 sol-gel films deposited on [100] Si wafer substrates.
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