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Electronic punch on the thiolated-Au films by atomic force microscopy
Younghun Kim1, Jeongjin Lee, Jongheop Yi
1Department of Chemical Engineering, Kwangwoon University, Seoul 139-701, Korea.
Journal of Nanoscience and Nanotechnology
|February 10, 2009
Summary
A new atomic force microscopy (AFM) oxidation method directly measures thiolated-gold film thickness. This "electronic punch" technique offers a precise way to determine organic and gold layer dimensions.
Area of Science:
- Materials Science
- Surface Science
- Nanotechnology
Background:
- Ellipsometry is a common indirect method for measuring self-assembled monolayer (SAM) thickness.
- Existing methods often lack directness and precision for multilayered films.
Purpose of the Study:
- To introduce a direct atomic force microscopy (AFM) oxidation method for estimating thiolated-gold film thickness.
- To provide a precise technique for analyzing multilayered organic and gold films.
Main Methods:
- Utilizing atomic force microscopy (AFM) with oxidation.
- Applying bias voltage to cleave sulfur-gold bonds via desorption.
- Observing nano-explosion through electron tunneling at the probe tip-surface nano-contact.
- Developing the 'electronic punch' procedure for layer-by-layer analysis.
Main Results:
- A multi-step uncovered layer is successfully obtained on thiolated-gold films.
- The method allows for the estimation of individual organic and gold layer thicknesses.
- Demonstrated applicability to multilayered thiolated-gold films.
Conclusions:
- The 'electronic punch' AFM oxidation method provides a direct and accurate approach for thickness measurement.
- This technique overcomes limitations of indirect methods like ellipsometry for complex film structures.
- The method is suitable for analyzing multilayered thiolated-gold films.
