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Published on: April 19, 2018
Measuring glassy and viscoelastic polymer flow in molecular-scale gaps using a flat punch mechanical probe
Harry D Rowland1, William P King, Graham L W Cross
1Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, Illinois 61801, USA.
This study explores polymer mechanical deformation in polystyrene films during squeeze flow. Results show molecular weight influences behavior at high temperatures, enabling thinner films for nanoimprint lithography.
Area of Science:
- Polymer Physics
- Materials Science
- Nanotechnology
Background:
- Understanding polymer mechanical deformation at the molecular scale is crucial for advanced manufacturing processes like nanoimprint lithography.
- Polystyrene (PS) films exhibit complex behavior under large-strain squeeze flow, influenced by molecular weight (M(w)) and deformation conditions.
Purpose of the Study:
- To investigate molecular-scale polymer mechanical deformation during large-strain squeeze flow of PS films.
- To determine the influence of molecular weight, temperature, and deformation rate on the mechanical response.
- To assess the potential for reducing residual film thickness in nanoimprint lithography.
Main Methods:
- Measured stress-strain and creep relations during flat punch indentation of PS films.
- Varied initial film thickness (170 nm to 10 nm), molecular weight (M(w)), and deformation stress rate.
- Conducted experiments across a temperature range of 20 to 125 °C.
Main Results:
- Stress-strain response was M(w)-independent at low temperatures, consistent with bulk glassy polymer theory.
- At high temperatures, M(w) degeneracy was broken, but no molecular confinement effects were observed.
- Creep measurements for lower M(w) films matched bulk Newtonian flow predictions.
- Mechanical relaxation scaled with temperature, similar to Williams-Landel-Ferry (WLF) scaling.
- High M(w) films exhibited shear-thinning behavior but could not be precisely modeled.
- Loading rate and magnitude affected extrusion depth in high-M(w) films.
Conclusions:
- The study provides insights into the molecular-scale deformation mechanisms of polystyrene films under squeeze flow.
- Findings suggest that optimized high strain and strain rate loading of high-M(w) thin films can reduce residual film thickness.
- This has implications for improving mold flash reduction and achieving thinner residual films in high-resolution nanoimprint lithography.
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