Updated: Jun 23, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Tao Lu1, Lan Yang, Rob V A van Loon
1Applied Physics Department, California Institute of Technology, Pasadena, California 91125, USA.
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We developed an erbium-doped silica microcavity laser on a silicon chip that emits visible light. High-Q cavities enable room-temperature upconversion lasing, overcoming typical limitations in pure silica.
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