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Optical precision profilometer using the differential method.

M Adachi, H Miki, Y Nakai

|September 11, 2009

Summary

This summary is machine-generated.

A new optical precision profilometer minimizes vertical vibration effects for accurate height measurements. This advanced instrument enables precise surface analysis of materials like silicon wafers, achieving a low noise level of 0.05 nm root mean square.

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Area of Science:

Optical Engineering
Metrology
Surface Science

Background:

Vertical vibrations significantly impact the accuracy of optical precision profilometry.
Existing methods often struggle to compensate for environmental disturbances during high-precision measurements.

Purpose of the Study:

To propose a novel optical precision profilometer design.
To achieve height measurements that are nearly independent of vertical vibrations.
To demonstrate the instrument's capability for precise surface analysis.

Main Methods:

Development of an optical profilometer incorporating simultaneous measurement of the target and its surroundings.
Implementation of digital subtraction to eliminate the influence of ambient vibrations.
Characterization of the profilometer's noise level under controlled vibration conditions (0.4 gal).

Main Results:

The proposed profilometer demonstrates near-independence from vertical vibrations.
A low noise level of 0.05 nm root mean square was achieved under steady vibrations.
Successful measurements were performed on an optical flat and a silicon (Si) wafer.

Conclusions:

The novel optical profilometer offers a robust solution for high-precision surface metrology.
The digital subtraction technique effectively mitigates vibration-induced errors.
The instrument is suitable for characterizing delicate optical surfaces and semiconductor wafers.