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Characterization of SiN Integrated Optical Phased Arrays on a Wafer-Scale Test Station
Published on: April 1, 2020
1Department of Electrical Engineering, City College of City University of New York, New York, New York 10031, USA.
A new optical interconnect design for single-instruction-multiple-data (SIMD) processing elements in a ring formation is introduced. This topology offers advantages like space-invariant components and consistent latency compared to traditional rectangular arrays.
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