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Flow-assisted Dielectrophoresis: A Low Cost Method for the Fabrication of High Performance Solution-processable Nanowire Devices
Published on: December 7, 2017
Fabricating nanowire devices on diverse substrates by simple transfer-printing methods
Chi Hwan Lee1, Dong Rip Kim, Xiaolin Zheng
1Department of Mechanical Engineering, Stanford University, CA 94305, USA.
Summary
New transfer-printing methods enable nanowire (NW) device fabrication on diverse flexible substrates. These techniques overcome limitations of traditional methods, enabling applications in flexible electronics and sensors.
Area of Science:
- Materials Science
- Nanotechnology
- Device Fabrication
Background:
- Nanowire (NW) device fabrication is crucial for flexible electronics, sensors, and solar cells.
- Current lithographic methods limit substrate choices due to high temperatures and material compatibility.
Purpose of the Study:
- To develop novel transfer-printing methods for fabricating NW devices on a wide range of substrates.
- To overcome the substrate limitations imposed by traditional lithographic techniques.
Main Methods:
- Three distinct transfer-printing techniques were developed.
- Methods utilize adhesion differences to transfer NWs, metal films, and devices.
- Diverse substrates including polymers, tapes, and Petri dishes were used as receivers.
Main Results:
- Successful fabrication of NW devices on various unconventional substrates.
- Electrical characterization confirmed reliable ohmic contacts between NWs and electrodes.
- Silicon NW devices demonstrated robust performance as piezoresistive stress and temperature sensors.
Conclusions:
- Transfer-printing offers a versatile approach for NW device fabrication on diverse substrates.
- This method expands the possibilities for flexible and conformable electronic devices.
- Fabricated NW sensors exhibit reliable performance, paving the way for practical applications.
