Characterization of a nanoparticle-filled resin for application in scan-LED-technology

Scan-LED-technology is a new rapid prototyping technique with increasing applications in the production of custom-made medical products. The present work is dealing with the examination of a silica/urethandimethacrylate (UDMA) nanocomposite for application in scan-LED-technology. The use of specific LED in a photo-DSC unit enables the simulation of crucial parameters of nanoparticle-filled resins for their application in scan-LED-technology. The conversion of double bonds during the curing reaction and the rate of conversion were studied as a function of radiation intensity, silica nanoparticle content, and silanization of the nanoparticles with 3-methacryloyloxypropyl-trimethoxysilane (MPTMS). The conversion of double bonds is increasing with increasing radiation intensity. The increasing conversion of the nanoparticle-filled resins is discussed as a combined effect of increasing nanoparticle content, alternated initiator/double bond ratio and increasing radiation intensity. A significant dependence of the reaction rate on nanoparticle content could not be found. Only for the unfilled resin, the rate was increasing at higher radiation intensities. The influence of residual solvent on conversion and rate of reaction was also analyzed. TGA measurements combined with FTIR were used to study the silanization of the nanoparticles. The silane layer thickness on the surface of the silica nanoparticles was determined.