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Updated: May 25, 2026

A Stable Phantom Material for Optical and Acoustic Imaging
Published on: June 16, 2023
Angular measurement of acoustic reflection coefficients by the inversion of V(z, t) data with high frequency
Jian Chen1, Xiaolong Bai, Keji Yang
1The State Key Laboratory of Fluid Power Transmission and Control, Zhejiang University, Hangzhou, People's Republic of China.
Abstract:
For inspection of mechanical properties and integrity of critical components such as integrated circuits or composite materials by acoustic methodology, it is imperative to evaluate their acoustic reflection coefficients, which are in close correlation with the elastic properties, thickness, density, and attenuation and interface adhesion of these layered structures. An experimental method based on angular spectrum to evaluate the acoustic coefficient as a function of the incident angle, θ, and frequency, ω, is presented with high frequency time-resolved acoustic microscopy. In order to achieve a high spatial resolution for evaluation of thin plates with thicknesses about one or two wavelengths, a point focusing transducer with a nominal center frequency of 25 MHz is adopted. By measuring the V(z, t) data in pulse mode, the reflection coefficient, R(θ, ω), can be reconstructed from its two-dimensional spectrum. It brings simplicity to experimental setup and measurement procedure since only single translation of the transducer in the vertical direction is competent for incident angle and frequency acquisition. It overcomes the disadvantages of the conventional methods requiring the spectroscopy for frequency scanning and/or ultrasonic goniometer for angular scanning. Two substrates of aluminum and Plexiglas and four stainless plates with various thicknesses of 100 μm, 150 μm, 200 μm, and 250 μm were applied. The acoustic reflection coefficients are consistent with the corresponding theoretical calculations. It opened the way of non-destructive methodology to evaluate the elastic and geometrical properties of very thin multi-layers structures simultaneously.
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