Related Experiment Video
Updated: May 22, 2026

13:44
Simulation, Fabrication and Characterization of THz Metamaterial Absorbers
Published on: December 27, 2012
Note: three-dimensional stereolithography for millimeter wave and terahertz applications
A Macor1, E de Rijk, S Alberti
1Institute of Condensed Matter Physics, Station 3, EPFL, 1015 Lausanne, Switzerland.
The Review of Scientific Instruments
|May 8, 2012
Summary
3D stereolithography enables new metal-coated polymer components for millimeter and terahertz waves. This manufacturing method allows complex designs and speeds up production for passive electromagnetic devices.
Area of Science:
- Materials Science
- Electromagnetics
- Additive Manufacturing
Background:
- Traditional manufacturing methods for millimeter and terahertz (THz) passive components often limit design complexity and increase production times.
- The need for advanced passive components in millimeter and THz applications necessitates innovative fabrication techniques.
Purpose of the Study:
- To introduce and evaluate a novel manufacturing approach for passive components operating in the millimeter and THz frequency ranges.
- To demonstrate the capability of 3D stereolithography for creating complex metal-coated polymer structures.
Main Methods:
- Utilizing 3D stereolithography to fabricate polymer substrates with intricate geometries.
- Applying metal coatings to the 3D-printed polymer structures to create functional passive electromagnetic components.
- Testing the performance of fabricated components at 92.5, 140, and 170 GHz.
Main Results:
- Successfully manufactured complex shapes such as corrugated horns and mirrors using the proposed method.
- Demonstrated the feasibility of producing functional passive components for millimeter and THz waves.
- Verified component performance through testing at specified high frequencies.
Conclusions:
- 3D stereolithography of metal-coated polymers presents a versatile and efficient manufacturing solution for millimeter and THz passive components.
- This technique significantly enhances design flexibility and reduces manufacturing lead times for complex electromagnetic devices.

