Complex three-dimensional high aspect ratio microfluidic network manufactured in combined PerMX dry-resist and SU-8 technology

In this paper we present a new fabrication method that combines for the first time popular SU-8 technology and PerMX dry-photoresist lamination for the manufacturing of high aspect ratio three-dimensional multi-level microfluidic networks. The potential of this approach, which further benefits from wafer-level manufacturing and accurate alignment of fluidic levels, is demonstrated by a highly integrated three-level microfluidic chip. The hereby achieved network complexity, including 24 fluidic vias and 16 crossing points of three individual microchannels on less than 13 mm(2) chip area, is unique for SU-8 based fluidic networks. We further report on excellent process compatibility between SU-8 and PerMX dry-photoresist which results in high interlayer adhesion strength. The tight pressure sealing of a fluidic channel (0.5 MPa for 1 h) is demonstrated for 150 μm narrow SU-8/PerMX bonding interfaces.