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Updated: May 20, 2026

Fabrication of Spatially Confined Complex Oxides
08:45

Fabrication of Spatially Confined Complex Oxides

Published on: July 1, 2013

Diffusion of co-sputtered metals as bonding materials for 3D interconnects during thermal treatments

S Y Hsu1, H Y Chen, K N Chen

  • 1Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan.

Journal of Nanoscience and Nanotechnology
|July 5, 2012
PubMed

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