Ductile fracture mechanism of low-temperature In-48Sn alloy joint under high strain rate loading
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Updated: May 20, 2026

A Method for Studying the Temperature Dependence of Dynamic Fracture and Fragmentation
Published on: June 28, 2015
Jong-Woong Kim1, Seung-Boo Jung
1Energy-Display R&D Division, Korea Electronics Technology Institute, Seongnam 463-816, Korea.
Abstract:
The failure behaviors of In-48Sn solder ball joints under various strain rate loadings were investigated with both experimental and finite element modeling study. The bonding force of In-48Sn solder on an Ni plated Cu pad increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloy. In contrast to the cases of Sn-based Pb-free solder joints, the transition of the fracture mode from a ductile mode to a brittle mode was not observed in this solder joint system due to the soft nature of the In-48Sn alloy. This result is discussed in terms of the relationship between the strain-rate of the solder alloy, the work-hardening effect and the resulting stress concentration at the interfacial regions.
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