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Published on: January 26, 2016
Reflection-based near-field ellipsometry for thin film characterization
Zhuang Liu1, Ying Zhang, Shaw Wei Kok
1Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore 638075, Singapore.
Ultramicroscopy
|November 13, 2012
Summary
A new near-field ellipsometry technique enables precise nano-scale thin film characterization. This advanced optical method accounts for sample-probe interactions and surface topography for high-resolution analysis.
Area of Science:
- Optics and Photonics
- Materials Science
- Nanotechnology
Background:
- Accurate characterization of nano-scale thin films is crucial for advanced material applications.
- Traditional ellipsometry methods face limitations in achieving high lateral resolution.
- Understanding near-field optical interactions is key to nanoscale metrology.
Purpose of the Study:
- To introduce a novel near-field ellipsometry method for nano-scale thin film characterization.
- To develop new ellipsometry equations incorporating near-field effects and surface topography.
- To demonstrate the capability of the method for high-resolution analysis.
Main Methods:
- Development of a reflection-based near-field optical detection configuration.
- Formulation of new ellipsometry equations considering near-field sample-probe interactions.
- Integration of thin film topography into the characterization model.
Main Results:
- Experimental validation of the proposed near-field ellipsometry technique.
- Simulation results confirming the method's precision and resolution.
- Demonstration of nano-scale lateral resolution in thin film analysis.
Conclusions:
- The developed near-field ellipsometry method offers precise characterization of nano-scale thin films.
- The technique effectively addresses challenges related to sample-probe interactions and surface topography.
- This advancement provides a powerful tool for nanoscale materials analysis and device fabrication.

