A harsh environment wireless pressure sensing solution utilizing high temperature electronics.

Area of Science:

• Materials Science
• Electrical Engineering
• Sensor Technology

Background:

• Current pressure sensing technologies are limited by electronics that fail above 300 °C.
• Harsh environments, particularly high temperatures, pose significant challenges for industrial pressure measurement.
• Need for robust, high-temperature pressure sensors in sectors like aerospace and energy.

Purpose of the Study:

• To develop a pressure sensing system capable of operating at 450 °C.
• To integrate Silicon Carbide (SiC) electronics with a commercial MEMS pressure sensor.
• To introduce wireless transmission for enhanced flexibility in extreme conditions.

Main Methods:

• Designed and developed a signal processing and wireless transmission module using Silicon Carbide (SiC) devices.
• Integrated the SiC module with a commercial piezoresistive MEMS pressure sensor.
• Conducted high-temperature bench testing from room temperature up to 450 °C.

Main Results:

• The entire pressure sensor suite, including the SiC electronics, successfully operated at 450 °C.
• Wireless functionality was achieved, eliminating the need for fragile cable connections.
• Prototype testing validated the system's performance under extreme temperature conditions.

Conclusions:

• A novel high-temperature pressure sensing technology has been demonstrated.
• The SiC-based system offers enhanced operational capability in extreme environments.
• Potential applications include real-time health monitoring of turbine engines and other industrial systems.