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Effects of multi-layer graphene capping on Cu interconnects.
Chang Goo Kang1, Sung Kwan Lim, Sangchul Lee
1School of Materials Science and Engineering, Gwangju Institute of Science and Technology, Gwangju 500-712, Korea.
Nanotechnology
|March 5, 2013
Summary
Multi-layer graphene (MLG) capping improves copper interconnects, reducing resistance by 2-7% and increasing breakdown current density by 18%. This demonstrates MLG
Area of Science:
- Materials Science
- Electrical Engineering
- Nanotechnology
Background:
- Copper interconnects are crucial for integrated circuits.
- Improving the reliability and performance of copper interconnects is essential for advanced electronics.
- Graphene has emerged as a promising material for electronic applications.
Purpose of the Study:
- To investigate the benefits of using multi-layer graphene (MLG) as a capping material for copper (Cu) interconnects.
- To evaluate the impact of MLG capping on the electrical resistance and breakdown current density of Cu wires.
- To assess the potential of MLG capped Cu interconnects for high-density applications.
Main Methods:
- Experimental demonstration of MLG capping on Cu interconnects.
- Electrical characterization of MLG capped Cu wires.
- Comparison of performance metrics between capped and uncapped Cu wires.
Main Results:
- MLG capping resulted in a 2-7% improvement in the resistance of Cu wires.
- The breakdown current density of MLG capped Cu wires increased by 18%.
- MLG demonstrated excellent capping properties for Cu interconnects, enhancing reliability.
Conclusions:
- Multi-layer graphene is an effective capping material for copper interconnects.
- MLG capping significantly improves the electrical performance and reliability of Cu interconnects.
- MLG capped Cu interconnects represent a promising technology for future high-density back-end-of-line interconnects.
