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Influence of embedding Cu nano-particles into a Cu/SiO2/Pt structure on its resistive switching
Chih-Yi Liu1, Jyun-Jie Huang, Chun-Hung Lai
1Department of Electronic Engineering, National Kaohsiung University of Applied Sciences, No,415, Chien Kung Road, Kaohsiung, 807, Taiwan. cyliu@cc.kuas.edu.tw.
Abstract:
Cu nano-particles (Cu-NPs) were embedded into the SiO2 layer of a Cu/SiO2/Pt structure to examine their influence on resistive switching characteristics. The device showed a reversible resistive switching behavior, which was due to the formation and rupture of a Cu-conducting filament with an electrochemical reaction. The Cu-NPs enhanced the local electric field within the SiO2 layer, which caused a decrease in the forming voltage. During successive switching processes, the Cu-NP was partially dissolved, which changed its shape. Therefore, the switching voltages were not reduced. Moreover, the Cu-NPs caused a non-uniform Cu concentration within the SiO2 layer; thus, the Cu-conducting filament should be formed in a high Cu concentration region, which improves switching dispersion. The Cu-NPs within the SiO2 layer stabilize the resistive switching, resulting in a larger switching window and better endurance characteristics.
