Direct imaging of 3D atomic-scale dopant-defect clustering processes in ion-implanted silicon

S Koelling1, O Richard, H Bender

  • 1IMEC, Kapeldreef 75, 3001 Leuven, Belgium. sebastian.koelling@cnt.fraunhofer.de

Nano Letters
|May 17, 2013
PubMed
Summary

This study introduces a new 3D imaging method using field ion microscopy to visualize boron clusters and atoms within semiconductor crystal defects. This technique enables atomic-scale characterization crucial for optimizing future electronic devices.

Related Concept Videos