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Updated: May 11, 2026

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All-electronic Nanosecond-resolved Scanning Tunneling Microscopy: Facilitating the Investigation of Single Dopant Charge Dynamics
Published on: January 19, 2018
Direct imaging of 3D atomic-scale dopant-defect clustering processes in ion-implanted silicon
S Koelling1, O Richard, H Bender
1IMEC, Kapeldreef 75, 3001 Leuven, Belgium. sebastian.koelling@cnt.fraunhofer.de
Nano Letters
|May 17, 2013
Summary
This study introduces a new 3D imaging method using field ion microscopy to visualize boron clusters and atoms within semiconductor crystal defects. This technique enables atomic-scale characterization crucial for optimizing future electronic devices.
Area of Science:
- Materials Science
- Semiconductor Physics
- Nanotechnology
Background:
- Precise dopant atom placement is key for nanoscale semiconductor devices.
- Fabrication processes like ion implantation and annealing involve dopant diffusion, activation, and clustering.
- Understanding atomic-scale mechanisms is vital for optimizing device performance.
Purpose of the Study:
- To demonstrate a novel 3D imaging technique for visualizing dopant clusters in semiconductors.
- To enable complete characterization of dopant-decorated crystal defects.
- To study the formation and dissolution of boron clusters in silicon at the atomic scale.
Main Methods:
- Field ion microscopy (FIM) for direct 3D imaging.
- Atomic-scale visualization of boron clusters and individual atoms.
- Characterization of dopant-decorated crystal defects.
Main Results:
- Successful 3D imaging of boron clusters and atoms within crystal defects.
- Complete characterization of the size and crystallographic orientation of boron-decorated defects.
- Demonstration of a new pathway to study dopant clustering dynamics.
Conclusions:
- Field ion microscopy provides unprecedented atomic-scale insight into dopant behavior.
- This method is crucial for understanding and controlling dopant clustering in silicon.
- The technique opens new avenues for optimizing semiconductor device fabrication and performance.

