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Inductive and ultrasonic multi-tier interface for low-power, deeply implantable medical devices
Ayodele Sanni1, Antonio Vilches, C Toumazou
1Electrical and Electronic Engineering Department, Centre for Bio-inspired Technology, Imperial College London, South Kensington Campus, London SW7 2AZ, UK. a.sanni08@imperial.ac.uk
IEEE Transactions on Biomedical Circuits and Systems
|July 16, 2013
Summary
This study introduces a novel wireless interface for powering and data transmission from deep implants. The system efficiently transfers power using inductive and ultrasonic methods, enabling low-power sensor operation.
Area of Science:
- Biomedical Engineering
- Implantable Devices
- Wireless Power Transfer
Background:
- Deeply implantable sensors require reliable wireless power and data transmission.
- Existing methods face challenges with power delivery efficiency and depth penetration.
Purpose of the Study:
- To develop a novel multi-tier interface for wireless power and data transfer to low-power, deeply implantable analog sensors.
- To achieve efficient power delivery and data collection from implanted devices.
Main Methods:
- The interface combines an inductive coupling subsystem and an ultrasonic subsystem.
- Inductive subsystem: PCB spiral coils, CMOS logic gate driver, 5W power transfer across 10mm air gap.
- Ultrasonic subsystem: PZT ceramic discs, low-frequency radial/planar excitation, 29 μW power delivery at 70mm depth in liquid.
Main Results:
- Inductive subsystem achieved 83% efficiency for power transfer.
- Ultrasonic subsystem delivered 29 μW power at 70mm depth with 1% efficiency.
- The implant is powered intermittently, providing ~18 msec for data transmission (4 bits).
Conclusions:
- The developed multi-tier interface enables wireless, noninvasive power and data transfer for deep implants.
- The system demonstrates feasibility for powering low-power sensors and transmitting collected data wirelessly.
- This technology has potential applications in medical monitoring and diagnostics.
