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The Frequency Domain Thermoreflectance Technique for Thermal Property Measurements
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Thermal property microscopy with frequency domain thermoreflectance.

Jia Yang1, Carlo Maragliano, Aaron J Schmidt

  • 1Department of Mechanical Engineering, Boston University, Boston, Massachusetts 02215, USA.

The Review of Scientific Instruments
|November 5, 2013
PubMed
Summary

This study introduces a thermal property microscopy technique to map thermophysical properties. It enables simultaneous imaging of thermal conductivity, heat capacity, and more in multilayer samples.

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Area of Science:

  • Materials Science
  • Physics
  • Nanotechnology

Background:

  • Frequency domain thermoreflectance (FDTR) is a microscopy technique for analyzing thermal properties.
  • Existing FDTR methods provide point measurements, limiting comprehensive material characterization.
  • Simultaneous mapping of multiple thermal properties is crucial for advanced material analysis.

Purpose of the Study:

  • To extend FDTR into an imaging technique for micrometer-scale mapping of thermophysical properties.
  • To develop a method for simultaneously quantifying various thermal properties in multilayer samples.
  • To demonstrate the capability of imaging buried layers and their thermal characteristics.

Main Methods:

  • Utilized a two continuous-wave laser setup for frequency domain thermoreflectance microscopy.
  • Recorded thermal phase images at multiple frequencies optimized for sensitivity to target thermal properties.
  • Applied point-by-point fitting of phase versus frequency curves to extract quantitative thermal property data.

Main Results:

  • Successfully generated micrometer-scale maps of multiple thermophysical properties simultaneously.
  • Demonstrated imaging of ~3 nm patterned titanium under 100 nm gold on silicon.
  • Obtained simultaneous maps of thermal interface conductance and substrate thermal conductivity.

Conclusions:

  • The developed FDTR microscopy technique enables quantitative imaging of thermal properties in multilayer systems.
  • This method is effective for characterizing buried layers, offering insights into thermal transport.
  • The technique shows significant potential for applications in integrated circuit analysis and materials science.