Site-selective growth of patterned silver grid networks as flexible transparent conductive film by using...

Metal transparent conductive films (TCFs) have received increasing attention in various flexible electronics. However, there are two crucial issues that need to be addressed: (1) strong adhesion between metal TCFs and the flexible substrates and (2) high conductivity with short treatment time and low process temperature, simultaneous with high transparency. In this paper, a site-selective electroless plating combination with poly(dopamine) modification is demonstrated to fabricate a new high performance transparent conductor composed of a periodic two-dimensional silver network on a heat sensitive flexible substrate at room temperature. The TCF reveals an extremely high ratio of DC to optical conductivity (σ(DC)/σ(Op)) value in the range of 350-1000 for various fabricated silver grid films. It also exhibits particularly strong adhesion, which can resist ultrasonic treatment in water or organic solvent for several hours. Its reliability (stable for at least 1440 h during 85 °C/85% RH aging) meets the essential requirements for microelectronic applications. Using this method, we obtain silver grid film on a flexible polyethylene terephthalate substrate with optical transmittance of 91% and sheet resistance of 8 Ohm sq(-1), which is comparable to or better than the commercially available indium tin oxide.