Improved metal-adhesive polymers from copper(I)-catalyzed azide-alkyne cycloaddition

Area of Science:

• Materials Science
• Polymer Chemistry
• Adhesive Technology

Background:

• Electrically conductive adhesive polymers present advantages over Sn-Pb solders, including lower toxicity and processing temperatures.
• Polymers from copper(I)-catalyzed cycloaddition (CuAAC) are known for metal-binding adhesive properties.

Purpose of the Study:

• To enhance the performance of CuAAC-based polymers as electrically conductive adhesives.
• To investigate the impact of flexibility-inducing components and tertiary amine additives on adhesive strength and conductivity.

Main Methods:

• Synthesized polymer formulations incorporating flexibility-inducing components and tertiary amine additives.
• Evaluated adhesive performance using rapid adhesion testing and ASTM standard lap-shear tests.
• Analyzed thermal properties via differential scanning calorimetry (DSC) and electrical conductivity with silver-coated copper flakes and carbon nanotubes.

Main Results:

• Incorporating flexible components more than doubled adhesive strength.
• Optimized concentrations of additives significantly improved material performance.
• Achieved electrical conductivity with 20 wt% silver-coated copper flakes, further enhanced by multiwalled carbon nanotubes.

Conclusions:

• CuAAC-based polymers can be significantly improved for use as high-performance electrically conductive adhesives.
• The strategic addition of flexible components and tertiary amines optimizes adhesive strength and functionality.
• These enhanced polymers offer a promising, versatile alternative to traditional soldering methods.